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#Datacon 2200 evo screenshot manual
#Datacon 2200 evo screenshot pro
#Datacon 2200 evo screenshot plus

Datacon 2200 & EVO machines Fully automatic die attach.įuture Proof Equipment Innovative Solution for Innovative Products The 2200 evoplus die bonder for Advanced Packaging. Suggestions: Make sure all words are spelled correctly. There were no results for datacon apm 2200 die bonder training in any of the components on SMTnet. IIn-line SMEMA YES YES YES SEMS/GEMS compliance YES YES YES Wafer lift and changer YES. 3 systems available for sale Options 1 2 3.

#Datacon 2200 evo screenshot plus

The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher. Details ID#: 9146586 Category: Die Attachers Vintage: 2006. Document/File: datacon-2200-evo-manual.pdf, filesize: n/a.ĭATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. The new world of advanced packaging 2200 evo Twin-Head Multi-Chip Die Bonder Maintenance Release 3.0 Documentation member of Besi group Version history Release 1.0 2.The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Datacon's 2200 evo will suit your laboratory development and high-volume production needs perfectly and will grow with your requirements.Datacon EVO 2200 Bond Head Auto Calibration. Consult BE Semiconductor Industries's 2200 evo brochure on DirectIndustry.Datacon 2200 evo plus Die placement temperature 120.

#Datacon 2200 evo screenshot manual

Manual flip-chip bonding high accuracy 0.5.

Datacon 2200 Bonder (flip chip process).

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It can be operated by seating personnel for best performance of the manual.

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The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

2200 evo plus Future Proof Equipment Innovative Solution for Innovative Products The 2200 evoplus die bonder for Advanced Packaging assembles all kinds of.

Datacon 2200 evo 1) High accuracy and multi function: The assembly precision up to + 10 (optional up to 7 m) Low loss, high capacity One machine can.

The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility.

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#Datacon 2200 evo screenshot pro

In January 2016, Micro Point Pro (MPP) acquired Kulicke and Soffa's manual wire bonder business unit. Datacon 2200 evo plus Esec 2100 SC Fico AMS-W.Make: Datacon Model: 2200 EVO Location: Asia and Pacific - Taiwan Semiconductor Equipment in Wanted Posted by: lucent.ĭATACON 2. The Future of Advanced Packaging Available Today. Datacon’s 2200 evo will suit your laboratory. Datacon EVO 2200 Automated multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate.